Chip Seal Design and Specifications – Implementation Phase (Phase II)

Project Details
STATUS

In-Progress

START DATE

06/29/17

END DATE

03/31/20

FOCUS AREAS

Infrastructure

RESEARCH CENTERS InTrans, AMPP
SPONSORS

Oregon Department of Transportation

Researchers
Principal Investigator
Ashley Buss

Faculty Affiliate

About the research

The first objective of the Phase II research is to facilitate implementation of the new chip seal design and accompanying performance specifications. In addition, there is a strong need to verify the design developed in Phase I. The primary objective of Phase II is to collaborate with the Oregon Department of Transportation to implement the findings of the new chip seal design methodology and performance specification by providing training and education. The second objective is to leverage the initial research investment to enhance the documentation of the chip seal performance tests sections and to verify that preliminary estimates developed using the design criteria are similar to actual field application rates.

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